Practical Guide to the Packaging of Electronics

Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysis, Third Edition provides a basic understanding of electronics packaging design issues, updated to reflect recent developments in the field. Early chapters provide a foundation in heat transfer, vibration, and life expectancy calculations. Topics include modes of heat removal; impact of thermal stresses; vibration and stresses; shock management; mechanical, electrical, chemically induced reliability; and more.